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01:19:53
The Origins of Silicon Valley: Characteristics of a Startup Environment
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00:18:59
Reliability Problems of Optoactive Materials in LED Packaging
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00:32:32
Addressing TIM Degradation in Lifetime Prediction of Data Center CPU/GPUs: Testing Methodology, Failure Definition and Performance of TIMs
57 views
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00:23:38
High Power Cooling with Dynamic Phase Change Materials
38 views
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00:40:16
Reliability of Microelectronic Interconnections: The Microstructure Matters!
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00:24:10
Mechanical Integrity of Hybrid Bonding
45 views
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00:18:12
Reliability Investigation for Scaling 3D Interconnects in Advanced Semiconductor Packaging
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00:23:44
Advanced Packaging Overview: Architectures, Challenges, and Technical Solutions
82 views
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00:32:47
Computational Modeling of Crack Initiation and Growth in BEOL Structures
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00:39:23
Insights into the Reliability of Advanced Glass Packages
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00:31:09
Thermal Management of Hybrid Integrated Lasers in Si Photonics
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00:15:48
Electromigration Failure Caused by Interdiffusion between Al Trace and Cu Seed Layer in the Microbump in 3D IC
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00:32:50
Electronic-Photonic Heterogeneous Integration for Co-Packaged Optics for High Performance Computing
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00:07:17
Overview of Advanced System Integration and Packaging (ASIP) at Purdue University
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00:26:05
Electromigration and Thermomigration Behavior of Cu Microbumps in Stacked Die Assembly
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00:23:31
HALT and TC Reliability of QFN Assemblies with and without Urethane Coating
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00:28:10
Fault Isolation and Failure Analysis Challenges in Microelectronic Devices with Heterogeneous Integration: EDFAS FA Technology Roadmap Overview
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00:15:06
GDS Factory: Build Better Hardware with Better Software
36 views
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00:17:05
Mechanical Cycling to Facilitate Accelerated Degradation of TIMs
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00:24:05
Characterization and Modelling of Epoxy Mold Compounds for High-Voltage Integrated-Circuit Packages
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00:19:41
Pool Boiling Performance and Reliability of Copper and Nickel Inverse Opal Structures
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00:37:51
Cryogenic CMOS Technologies for Quantum Computing Systems
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00:15:23
Experiences of Electronics Packaging at Scania: Challenges and Opportunities
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