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On-Shoring The Next Generation Of Advanced Packaging

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#heterogeneous integration #FOWLP #bonding #substrates #chiplets #domestic USA sourcing

(37:45 + Q&A)  Charles Woychik, Ph.D., SkyWater Technology  -- HI, FOWLP, cu-to-cu bonding, 2.5D & 3D, chiplets, domestic sourcing, investments ... 
Summary: Electronics packaging is the critical enabling technology to achieve 3D heterogeneous integration (HI). The core HI advanced packaging technologies ...

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Paul Wesling

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