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Displaying 2304 of 8050 videos.

01:04:32

Navigating Competitive Grant Application Processes

00:17:00

IEEE IHTC 2021 - Advancing Sustainability - IEEE Thought Leadership & New Initiatives on Sustainable Development

13:47:00

IEEE IHTC 2021 - Innovation for Humanitarian Technologies Development in Latin America and The Caribbean

11:26:00

IEEE IHTC 2021 - Region 7 2021 Humanitarian Activities and Future Plan

17:53:00

IEEE IHTC 2021 - Humanitarian Activities in Africa Middle East and Europe

00:29:00

IEEE IHTC 2021 - IEEE: Advancing Technology to Benefit Humanity

00:03:16

Biomagnetics-using magnetic fields to precisely excise cancer

01:00:00

Improved Bus Service on Ten Times less Energy

00:54:07

New Routes And Paradigms In Device Engineering For Nanoelectronics And Nanosystems

00:16:05

Adrian Stoica: Telepresence, Avatars and Workshop Closing Remarks - IEEE Telepresence Workshop 2021

00:12:22

Shear Performance and Accelerated Reliability of 6×6 mm FOWLP Solder Joints using an ENIG PCB Electrode

00:30:16

Invited Talk: Degradation Mechanism of High Power LED Packaging in Outdoor Environment and its Acceleration Model

00:24:02

Micro Pillar Support Structure for Mechanical Reliability of Silicon Ultra-Thin Vapor Chambers

00:30:58

Testing Heterogeneous Integration and Supply Chain Implications

00:47:02

In-Vehicle Display Technology Development and Challenges

00:51:24

Silicon Photonics: Integration, Reliability Challenges and Future Requirements

01:43:38

Tutorial: Achieving High Reliability for Lead-Free Solder Joints: Materials Considerations

00:23:03

Correlation Between Delamination and Solder Joint Fatigue of QFN Package

00:36:17

Thermo-mechanical Analyses on Mounted Flip-Chip BGA Applicable in High Performance Vehicle Computers

00:44:06

Overview and Challenges of Silicon Photonics Device Reliability

00:23:24

Analysis of Flexible PCBs: Trace Reinforcement Approach

00:27:11

Co-Design Methodology for Reliable 3D-Integrated DWDM Silicon Photonics

00:28:07

Advanced Package Technologies and their Reliability Challenges

00:26:09

Introduction of ISPG Method and Geometric Multiscale Modeling for Electronics Solder Reflow and Shock Wave Analysis